Chemical Palladium Plating ; Electroless Palladium Plating on Printed Circuit Board ; FF-7884
PRODUCT DESCRIPTION
Homogeneous, bright and clean palladium coating. It meets the needs of micro fine printed circuit boards. It can provide an alternative to chemical gilding or be used as bottom layer. We can increase the wire bonding performance by making the best use of solder bond strength of chemical palladium plating.
Process Specification Conditions
| FF-7884Mu | 500ml/L |
| FF-7884A | 15ml/L |
| FF-7884B | 10ml/L |
| FF-7884C | Supplement use |
| pH | 7.8~8.2 |
| Temp. | 47~53℃ |
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